Five new EcoPaxx bioplastic grades launched
DSM Engineering Plastics (Sittard / The Netherlands; www.dsmep.com) has launched five new grades of its “EcoPaXX” bio-based, high performance engineering plastic. EcoPaXX is a polyamide (PA) 410 with typical long chain polyamide properties, such as low moisture absorption and high melting point – see Plasteurope.com of 04.08.2009. About 70% of the polymer is derived from castor oil, which is obtained from the Ricinus Communis plant. DSM says it has developed the new grades especially for injection moulding purposes.

EcoPaXX Q150-D is a general purpose, unfilled injection moulding grade, with potential applications including castor wheels and household equipment.

EcoPaXX Q-HG6 and Q-HG10 are glass-reinforced (30% and 50%), heat-stabilised injection moulding grades, with high resistance against hot water / glycol, hot oil and salt solutions. DSM says they are suitable for applications requiring high stiffness and toughness, such as parts in automotive cooling circuits, sensors that are exposed to oils and salts, and structural parts that are exposed to moist conditions.

EcoPaXX Q-HGM24 is a glass/mineral reinforced grade suitable for the injection moulding of large parts requiring low warpage and good surface quality, the company says. With a high melting point, the material can be used at relatively high operating temperatures. Potential applications include automotive engine covers.

DSM says EcoPaXX Q-KGS6 is a halogen-free flame-retardant glass reinforced (30%) compound which is light in colour so can easily be coloured in the standard industrial RAL colours. Potential applications include connectors, circuit breakers and switch bodies.

Three of the grades, Q-HG6, Q-HG10 and Q-HGM24, are already available commercially, while Q150-D and Q-KGS6 will be available in sample quantities starting this month, the company adds.
06.01.2011 Plasteurope.com [218070-0]
Published on 06.01.2011
DSM: Neue Typen des biobasierten Kunststoffs „EcoPaXXGerman version of this article...

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